By Topic

Adaptive Cooling of Integrated Circuits Using Digital Microfluidics

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Paik, P.Y. ; Adv. Liquid Logic, Inc., Research Triangle Park ; Pamula, V.K. ; Chakrabarty, K.

Thermal management is critical for integrated circuit (IC) design. With each new IC technology generation, feature sizes decrease, while operating speeds and package densities increase. These factors contribute to elevated die temperatures detrimental to circuit performance and reliability. Furthermore, hot spots due to spatially nonuniform heat flux in ICs can cause physical stress that further reduces reliability. While a number of chip cooling techniques have been proposed in the literature, most are still unable to address the varying thermal profiles of an IC and their capability to remove a large amount of heat is undermined by their lack of reconfigurability of flows. We present an alternative cooling technique based on a recently invented ";digital microfluidic"; platform. This novel digital fluid handling platform uses a phenomenon known as electrowetting, and allows for a vast array of discrete droplets of liquid, ranging from microliters to nanoliters, and potentially picoliters, to be independently moved along a substrate. While this technology was originally developed for a biological and chemical lab-on-a-chip, we show how it can be adapted to be used as a fully reconfigurable, adaptive cooling platform.

Published in:

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on  (Volume:16 ,  Issue: 4 )