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The complete design using a novel technique for an N-way planar high-power combiner is introduced for radio-frequency (RF) power amplifiers (PAs) at high-frequency (HF) range for the first time. On the basis of this design technique, a three-way planar combiner is simulated, designed and built on a ceramic-based material that allowed a surface-mount application. Design charts for a thermally reliable operation under high-power conditions are given. The simulated and measured results are compared and found to be very close. The design technique for planar combiners introduced here can be used for RF PAs to obtain power level in the several-kilowatt range in HF communication for industrial and military applications.