Cart (Loading....) | Create Account
Close category search window

Optimal Design and Control of CPU Heat Sink Processes

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Chyi-Tsong Chen ; Feng Chia Univ., Taichung ; Ching-Kuo Wu ; Hwang, Chyi

This paper considers the optimal plate fin design and control for central processing unit (CPU) heat sink processes. First, we apply a finite element method to investigate the heat transfer phenomena of a heat sink process. To have a better heat dispersion performance, a real-coded genetic algorithm is then utilized to search for an optimal set of plate-fin shape parameters. The objective function to be minimized is the entropy generation rate which can take simultaneously the two major factors, heat transfer rate and air resistance, into consideration in the design. The present optimization scheme is able to achieve a better design for heat dispersion than existing methods. To attenuate environmental and time-varying disturbances, a direct adaptive control scheme is then developed for the CPU heat sink process. It is based on using a bounded single neuron controller (SNC) along with a parameter tuning algorithm to regulate the temperature of a selected control point. Extensive comparisons of the SNC-based control performance with the on-off control as well as a PI controller show that the proposed scheme provides excellent control performance despite the existence of unexpected process uncertainties.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:31 ,  Issue: 1 )

Date of Publication:

March 2008

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.