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Dual Wavelength Femtosecond Laser Materials Processing

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4 Author(s)
Masanao Kamata ; Cyber Laser Inc. R&D group, Telecom center Building, 2-38 Aomi, Koto-ku, Tokyo, Japan. ; Susumu Tsujikawa ; Tetusmi Sumiyoshi ; Hitoshi Sekita

Femtosecond laser ablation using the combination of 260 nm pulses and 780 nm pulses is explored for the high speed and high quality selected removal of insulating layers.

Published in:

2007 Conference on Lasers and Electro-Optics (CLEO)

Date of Conference:

6-11 May 2007