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A novel VLSI technology to manufacture high-density thermoelectric cooling devices

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3 Author(s)
Chen, H. ; IBM Corp., New York ; Hsu, L. ; Xiaojin Wei

This paper describes a novel integrated circuit technology to manufacture high-density thermoelectric devices on a semiconductor wafer. With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient temperature, and may be used for temperature control or heating if the direction of current flow is reversed. By using a monolithic process to increase the number of thermoelectric couples, the proposed solid-state cooling technology can be combined with traditional air cooling, liquid cooling, and phase-change cooling to yield greater heat flux and provide better cooling capability.

Published in:

Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on

Date of Conference:

17-19 Sept. 2007