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13th International Workshop on THERMal INvestigation of ICs and systems

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The following topics are dealt with: 3D stacked packaging; transient thermal characterization; solder joints reliability; microscale cooling; compact modeling theory; cooling technologies; experimental analysis; thermal management; thermal resistance; high power LEDs; multi-physics simulation and package reliability.

Published in:

Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on

Date of Conference:

17-19 Sept. 2007