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Thermal Management of a Stacked-Die Package in a Handheld Electronic Device Using Passive Solutions

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3 Author(s)
Sung-Won Moon ; Intel Corp., Chandler ; Prstic, S. ; Chia-pin Chiu

Various passive thermal management schemes are discussed for a high power component in a handheld electronic device. The validated package and system thermal model based on JEDEC standards and a cell phone mock-up testing were used for the extensive analysis. Also the empirical data was collected to validate thermal improvement predicted by computational fluid dynamics analysis. By using the validated thermal model, the design cycle and time-to-market can be significantly reduced.

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Components and Packaging Technologies, IEEE Transactions on  (Volume:31 ,  Issue: 1 )