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Operating frequency and speed growth rapidly today, 3C product demand more light, thin and small that can easily to bring anywhere. That's mean more complex IC package architecture and high performance substrate design to place maximum amount of passives with lower interconnect are decisive factors of product successful. In this study, present an integrated process to place more than one discrete capacitor in packaging substrate by build via. And relation electrical performances is measured by Vector Network Analysis with high frequency probing system, high frequency EM simulation done by Ansoft 3D full wave EM solver will be presented also in this study completely. Study result indicted that embedded capacitor technology has the potential to perform high electrical performance and cost/area saving denser packaging.