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Modeling and quantification of substrate noise induced by interconnects in SOCs

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2 Author(s)
Aghnout, S. ; Univ. of Tehran, Tehran ; Masoumi, N.

Interconnects carrying high-frequency signals are of the most important sources of substrate noise. This paper computes the amount of the interconnect-induced substrate noise. We develop a substrate extraction tool based on the Finite Difference Method and combine the extracted output model with accurate interconnect models. Through simulation of the complete substrate-interconnect model, we investigate the impacts of frequency and several interconnect geometrical parameters on the amount of the substrate noise.

Published in:

Design & Technology of Integrated Systems in Nanoscale Era, 2007. DTIS. International Conference on

Date of Conference:

2-5 Sept. 2007