Chip package co-design of receiver front-end for 4G mobile phones

Next generation wireless communications terminals will demand the use of advanced component integration processes and high density packaging technologies in order to reduce size and to increase performance. This paper presents high density multilayer interconnects and integrated passives used to design high performance prototype module for 5 GHz wireless LAN receiver realized on MCM-D substrate. The thin film implementation of multichip module technology is identified as a useful platform for the integration of GaAs MMIC and silicon device technologies for microwave applications where performance, size and weight are critical factors. The ability of the MCM-D technology to provide controlled impedance, microstrip structures and integrated thin film passive components with useful performance in the microwave frequency regime has now been demonstrated.