By Topic

Design and Analysis of Ultra-Miniaturized Meandering Photonic Crystals Delay Lines

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Fakharzadeh, M. ; Dept. of Electr. & Comput. Eng., Waterloo Univ., Waterloo, ON ; Ramahi, Omar M. ; Safavi-Naeini, S. ; Chaudhuri, S.K.

In this paper, we study the characteristics of a novel miniaturized optical delay line, which delays light in a meandering photonic crystal waveguide, and describe the design steps. We show how lattice parameters and refractive index difference of the photonic crystal affect the bandgap width and suggest a criterion to select these parameters. Next, we focus on the parallel waveguide channels in photonic crystal, and analyze the impact of the channel length and the interchannel spacing on crosstalk. We suggest a method for mitering the sharp corners in meandering lines which reduces the undesired reflections by 8 dB. Considering all these guidelines, we examine the propagation of light in the proposed delay line through calculating time-delay and insertion loss. To achieve longer delays in a small device area, we concentrate on coupled cavities in photonic crystals and propose an approximate method for calculating the group velocity of light in the coupled defects. We show how by replacing waveguide channels of a meandering delay line with coupled defects we achieve time-delays more than 9 ps within a device size around 27 m, which corresponds to a miniaturization factor of 100.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:31 ,  Issue: 2 )