Referenced Items are not available for this document.
A review of materials and optimization of seal designs is given with emphasis on the requirements for semiconductor manufacturing equipment. Various attributes are delineated as they pertain to aggressive temperature and chemical environments.
Published in:
Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on
Date of Conference: 15-17 Oct. 2007
- Page(s):
- 1 - 4
- ISSN :
- 1523-553X
- E-ISBN :
- 978-1-4244-1142-9
- Print ISBN:
- 978-1-4244-1142-9
- INSPEC Accession Number:
- 9833449
- Conference Location :
- Santa Clara, CA
- Digital Object Identifier :
- 10.1109/ISSM.2007.4446847
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