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Comprehensive interconnect etch tool qualification methodology for high volume mixed technology node production

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8 Author(s)
Frankwicz, P.S. ; Nat. Semicond. Corp., South Portland ; Clark, R. ; Hayes, K. ; Johnson, M.
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Incoming production to this tool set can span technology nodes of 500nm to 180nm; I-line to deep ultraviolet photoresist and numerous anti-reflective coating (ARC) and interconnect metal stack schemes. This paper will discuss the methodology and merits of a multiple parametric qualification (MPQ) protocol for high volume mixed node metal interconnect etch production.

Published in:

Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on

Date of Conference:

15-17 Oct. 2007