Cart (Loading....) | Create Account
Close category search window
 

Reliability Research on the Thermal Deformation and Stress of Metal Packaging With Low-Resistance Leads

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Rui Bai ; ABAQUS China Beijing Representative Office, Beijing ; Jun Long Bie ; Xue Wei Sun ; Songliang Jia
more authors

Thermomechanical reliability of the metal packaging with low-resistance and high-electric current was discussed in this paper. Thermal deformations and stresses of packaging structures were studied by both experimental and numerical methods. Laser speckle interferometry was used as the experimental method to test the coefficient of thermal expansion of the metal composite leads and the thermal deformations of the entire packaging structures due to the temperature change from room-temperature to 150degC. ABAQUS/standard finite element (FE) code was used to simulate the thermal deformations and stresses of the packaging structures from room temperature to 150degC. The facts show that the results were in good agreement with those of experiments. It showed that the predicted thermal stresses and deformation in the working condition were qualitatively reliable. Moreover, the technique of elements deactivating and activating was used in FE analysis to simulate the manufacturing process of the packaging structures cooled from 779degC to room-temperature. Then the residual thermal deformations and stresses during the process were obtained.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:31 ,  Issue: 1 )

Date of Publication:

2008 0

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.