By Topic

Synthesis and Characterization of Novel Multiaromatic Epoxy Resin for Advanced Microelectronic Packaging Applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Zhiqiang Tao ; Chinese Acad. of Sci., Beijing ; Jiapei Ding ; Haixia Yang ; Lin Fan
more authors

The novel multiaromatic epoxy resin and hardener was synthesized and characterized. The mechanical, thermal, electrical as well as flame retardant properties of cured epoxy resins were systematically investigated. Experiment results indicated that the cured novel multiaromatic resins exhibited very good mechanical properties, good electrical properties, high glass transition temperature, good dielectric properties, low moisture absorption and very good flame retardancy.

Published in:

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Date of Conference:

14-17 Aug. 2007