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Development of Multi Chip Module BGA Package for High Power Application

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1 Author(s)
Y. Y. Ma ; Packaging Analysis and Design Center, United Test and Assembly Center Ltd, 5th Serangoon North Ave 5, 554916, Singapore. Email: yy

The relentless trend of ever increasing functionality integration and die shrinkage for cost reduction and miniaturization of products has led to intense heat dissipation in IC chips. UTAC has successfully developed a simple alternative thermal enhancement technology, which overcomes those problems inherent to HS-PBGA. Aiming to minimize prototype revisions and reduce overall turnaround time from design, to prototype, to high volume assembly production, this paper describes approaches of the design optimization for XP-BGA through mechanical and thermal modeling on designed experimental legs. Result shows that the predicted and actual measurement for thermal performance and mechanical warpage was less than 5%, and 45% respectively in terms of error range.

Published in:

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Date of Conference:

14-17 Aug. 2007