Cart (Loading....) | Create Account
Close category search window
 

Development of Multi Chip Module BGA Package for High Power Application

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Ma, Y.Y. ; United Test & Assembly Center Ltd, Singapore

The relentless trend of ever increasing functionality integration and die shrinkage for cost reduction and miniaturization of products has led to intense heat dissipation in IC chips. UTAC has successfully developed a simple alternative thermal enhancement technology, which overcomes those problems inherent to HS-PBGA. Aiming to minimize prototype revisions and reduce overall turnaround time from design, to prototype, to high volume assembly production, this paper describes approaches of the design optimization for XP-BGA through mechanical and thermal modeling on designed experimental legs. Result shows that the predicted and actual measurement for thermal performance and mechanical warpage was less than 5%, and 45% respectively in terms of error range.

Published in:

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Date of Conference:

14-17 Aug. 2007

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.