Cart (Loading....) | Create Account
Close category search window
 

Research of 3D Routing System of Electronic Equipment

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Zliaohua Wu ; Guilin Univ. of Electron. Technol., Guilin ; Dejian Zhou ; Yiiifeng Wu

Fast routing is one of the bottlenecks affecting the fast manufacturing of electronic equipments. The three-dimensional auto-routing system ( 3DRS) of electronic equipment is designed on the of unigraphics ( UG ) which is a three-dimensional(3D) modelling software. 3D weighed grid is applied to mesh the 3D routing space of electronic equipment, the labyrinth algorithm based on grid is used to search the route of wire. In order to describe the non-structure questions of 3D cabling space of the electronic equipment, a routing knowledge base which contains EMC analysis primarily is also designed in the system to guide routing. Based on the powerful 3D modelling ability of UG. the system is developed using Visual C++6.0 which is a visible programming tool.

Published in:

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Date of Conference:

14-17 Aug. 2007

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.