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The Thermal Analysis of QFP Components Geared to the Needs of the Application of Encapsulation Design and Assembly

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3 Author(s)
De-jian Zhou ; Guilin University of Technology, Gulin 541004, Guang Xi, China. Email: ; Hong-yan Huang ; Kai-qiang Peng

That the QFP components are applied successfully depends on its heat design and analysis. So, in tins paper, facing the application of encapsulation design and assembly, a three dimensional model based on temperature field and its simulation analysis is carried out by using the finite element method under different cooling condition and structure parameters, according to such problems for QFP as cooling design the heat effect of the thickness of encapsulation layer and chip. And, some relevant results are achieved and some corresponding advices for heat design are put forward with practice. These methods and conclusions can provide the QFP designer of structure and techniques of components encapsulation and assembly a lot of references.

Published in:

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Date of Conference:

14-17 Aug. 2007