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The Components Layout Optimization of Circuit Module Based on the Artificial Nerve Network

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3 Author(s)
Hong-yan Huang ; School of Electro-Mechanical Engineering, Xidian University, Xi'an 710071, China; The Academy of Applied Science, Guilin University of Electronic Technology, Guilin 541004, China ; De-jian Zhou ; Zhao-hua Wu

In this paper a model for temperature field analysis is established by FEM (finite element method) and computer aided thermal simulation soft with regard to such factors affecting temperature as heat generation, heat diffusion manner and direction, ratio of length and width of component, thickness of PCB and so on. And the artificial nerve network method for components layout optimization is applied to achieve a reasonable components position in a small space and a best temperature distribution. Also some reference of concrete measure and method for thermal design is hoped to do the PCB designers a favor.

Published in:

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Date of Conference:

14-17 Aug. 2007