By Topic

New Sensor Packaging Concept for Avionic Application

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Aschenbrenner, R. ; Fraunhofer Inst. for Reliability & Microintegration, Berlin ; Jung, E. ; Braun, T. ; Oestermann, U.
more authors

A new packaging technology for a micro-electro-mechanical system (MEMS) pressure sensor was developed to allow the integration of the sensor in a probe mounted on the outside of the airplane. Thus this packaging concept will increase the reliability of equipment by avoiding extra pneumatic connections. Intrinsic advantages of this approach are the avoidance of pressure leaks and the elimination of bad pneumatic connection risk during installation or maintenance phases.

Published in:

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Date of Conference:

14-17 Aug. 2007