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New Sensor Packaging Concept for Avionic Application

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7 Author(s)
Aschenbrenner, R. ; Fraunhofer Inst. for Reliability & Microintegration, Berlin ; Jung, E. ; Braun, T. ; Oestermann, U.
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A new packaging technology for a micro-electro-mechanical system (MEMS) pressure sensor was developed to allow the integration of the sensor in a probe mounted on the outside of the airplane. Thus this packaging concept will increase the reliability of equipment by avoiding extra pneumatic connections. Intrinsic advantages of this approach are the avoidance of pressure leaks and the elimination of bad pneumatic connection risk during installation or maintenance phases.

Published in:

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Date of Conference:

14-17 Aug. 2007