By Topic

3-D Large-Scale IC/MEMS Co-Integration Using Liquid Solder for Flip-Chip Assembly

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)

In this paper, we discuss a flip-chip packaging method using liquid solder for 3D large-scale electronic/MEMS co-integration. This approach has been inspired from self-assembly technique which is emerging as one of the main methods for fabrication of heterogeneous micro-and nano-systems. We proposed to form solder bump by coating liquid solder directly on electrodes of a MEMS chip based on sophisticate microstructures of electrostatic microactuator array. Self-alignment and assembly techniques for electronic receptor chip were also detailed in order to achieve efficient flip-chip of MEMS and Electronic chip without any stiction and contamination problem. Functionality of the system has been validated and perspectives discussed.

Published in:

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Date of Conference:

14-17 Aug. 2007