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3-D Large-Scale IC/MEMS Co-Integration Using Liquid Solder for Flip-Chip Assembly

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3 Author(s)
Y. -A. Chapuis ; LIMMS/CNRS-IIS (UMI 2820), Institute of Industrial Science, University of Tokyo, Tokyo, Japan; InESS/ULP-CNRS (UMR 7163), University Louis Pasteur of Strasbourg, 23, rue du Loess, F-67037 Strasbourg, France. E-mail: ; A. Debray ; H. Fujita

In this paper, we discuss a flip-chip packaging method using liquid solder for 3D large-scale electronic/MEMS co-integration. This approach has been inspired from self-assembly technique which is emerging as one of the main methods for fabrication of heterogeneous micro-and nano-systems. We proposed to form solder bump by coating liquid solder directly on electrodes of a MEMS chip based on sophisticate microstructures of electrostatic microactuator array. Self-alignment and assembly techniques for electronic receptor chip were also detailed in order to achieve efficient flip-chip of MEMS and Electronic chip without any stiction and contamination problem. Functionality of the system has been validated and perspectives discussed.

Published in:

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Date of Conference:

14-17 Aug. 2007