By Topic

Experimental and Numerical Simulation Study on Uniformity of Temperature and Flow Field in an Advanced Packaging Electroplating Cell

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Dongsheng Zhu ; Educational Ministry Key Laboratory of Enhanced Heat Transfer & Energy Conservation, South China University of Technology, Guangzhou 510640, China; School of Mechanical and Power Engineering, East China University of Science and Technology, Shanghai 200237, China. E-mail:; Tel: +86-20-87114185-603 ; Changhong Wang ; Xuan Zhou ; Shandong Tu

An experimental facility of advanced packaging electroplating cell is developed to study the uniformity of the temperature and flow field in the high precision electroplating cell. Based on heat transfer and computational fluid dynamics, a 2D numerical model is founded to analyze the temperature field and flow field of the experimental electroplating cell enclosure. Combing with test and simulated results, the effects of the heat source intensity, ventilated mode and heat transfer coefficient on the thermal field of the cell are discussed. Under the condition of natural convection with temperature gradient driving, although heat/cold source intensity and ventilated mode both have effects on the temperature field and flow field of the electroplating enclosure, the heat/cold source is the more marked factor influencing the uniformity of temperature field and flow field. The experimental and simulated results can give a way to enhance the uniformity of the temperature field and flow field and to improve the quantity of the WL-CSP electroplating.

Published in:

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Date of Conference:

14-17 Aug. 2007