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Bandwidth simulation for high speed memory package

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5 Author(s)

This is a comparative study for varied type package performance. From the study, we are able to quantify the performance by parasitic parameter, bandwidth, voltage swing of Vref and skew simulation results.

Published in:

Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International

Date of Conference:

1-3 Oct. 2007