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3D integration of heterogeneous MEMS structures by stamping transfer

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4 Author(s)
Onoe, H. ; Univ. of Tokyo, Tokyo ; Iwase, E. ; Matsumoto, K. ; Shimoyama, I.

We propose an integration method of heterogeneous micro-electro-mechanical-system (MEMS) structures by liftoff and stamping transfer using a poly-(dimethylsiloxane) (PDMS) sheet. Silicon structures fabricated on multiple wafers were lifted off by PDMS sheets, and integrated onto a single wafer by the stamping transfer with high yield (>90%) and high accuracy (position error <500 nm). A two-dimensional (2D) integration and three-dimensional (3D) assembly of pyramid-like/inverted pyramid-like structures were demonstrated by our method. These demonstrations prove that our method enables us to integrate process-incompatible heterogeneous MEMS structures onto a single wafer.

Published in:

Micro Electro Mechanical Systems, 2007. MEMS. IEEE 20th International Conference on

Date of Conference:

21-25 Jan. 2007