By Topic

LF55GN photosensitive flexopolymer as a new material for ultra-thick and high aspect-ratio MEMS fabrication

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Sayah, A. ; Ecole Polytech. Fed. de Lausanne, Lausanne ; Parashar, V.K. ; Gijs, M.A.M.

We present the photosensitive flexopolymer LF55GN as a new material for the realisation of thick three-dimensional microstructures. The latter can be realised with a thickness up to 4 millimetres and with an aspect ratio of 10 using only a single UV exposure step. LF55GN is a unique material that allows fabricating thick components of optical quality that easily absorb stress due to the elastic nature of the material.

Published in:

Micro Electro Mechanical Systems, 2007. MEMS. IEEE 20th International Conference on

Date of Conference:

21-25 Jan. 2007