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This paper focuses on improving the reliability of electronic systems in the electronic packaging/manufacturing industry using failure mode and effect analysis (FMEA). The paper starts with the introduction to reliability and the FMEA, It briefly summarizes the research done in these areas, describes the benefits and limitations of the FMEA, compares various FMEA approaches, defines its scope, and offers suggestions for a multidiscipline and multifunctional team. It presents a FMEA form exclusively designed for the electronic systems industry, and provides a list of failure modes that should be considered while performing FMEA on electronic systems. While anticipating every failure mode is not possible, it formulates an extensive list of potential failure modes.
Date of Conference: 9-13 May 2007