By Topic

Thermomechanical Reliability of Lead Free Solder Joint in SMT Assembly

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Sandera, J. ; Brno Univ. of Technol., Brno

This conference paper focuses on the practical measurement of the reliability of the LF solder connection SMT mounted components on PCB. For measuring of the reliability a special printed boards with various footprints and Sn -HAL, immerse Sn and galvanic Au surface finishing were designed. Printed boards with vapour and wave soldered components underwent temperature cycling and failures (cracks) were evaluated. A temperature cycling +100deg C/0degC without dwell was applied. The electrical connection was measured continuously during the entire thermomechanical loading. This was done by connecting of a powered LED diode parallel to the examined solder joint. There was original equipment designed for the temperature cycling. The Peltier semiconductor cells were used for cooling and heating of the copper plate. On this plate the printed boards with components were placed. This solution had a low temperature capacity and it enabled relatively short temperature cycles.

Published in:

Electronics Technology, 30th International Spring Seminar on

Date of Conference:

9-13 May 2007