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This paper presents a novel approach in electronics packaging for high temperature environments. Especially electronics for automotive applications require effective packaging solutions which can withstand high temperatures. For these extreme conditions a new attempt, based on detailed knowledge about thermo-mechanical behavior of the utilized organic substrate materials, is necessary. Therefore different Thermal Analysis methods like Dynamic Mechanical Analysis (DMA) and Thermo Mechanical Analysis (TMRs) can be used to characterize material behavior and material degradation under diverse stress conditions. The DMA is a method which uses cyclic deformations for gaining information about visco-elastic material properties and to detect material phase transitions. The TMA reveals information about expansion properties and phase transitions as well. A short introduction to the difficulties in parameter extracting and interpreting is given. Subsequently results for epoxy based substrate materials which were exposed to thermal stress are presented. Effects for detectable property shifts and polymer degradation are described.