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The improvement of electronic interconnection systems reliability after implementation of EU Directive RoHS is currently one of the main goals in development of electronic equipment assembly. In fact, the reliability of equipment is created mainly during design and production stage. But these phases should be proceeded by research phase. During this phase the ecologically friendly materials and ecologically friendly technologies have to be selected and evaluated. Investigation of Pb-free technology for small producers of electronic equipment (SME 's) were made in Warsaw University of Technology (WUT) in frame of GreenRoSE Project financed by EC. First part of our work was concentrated on analyze the influence of reflow oven parameters setup on soldering temperature profile and related with it electrical and mechanical properties of solder joints. On the base of performed experiments the optimal oven parameters were selected and test samples were manufactured. Finally, the reliability data of SAC and SnPb solder on PCBs with Sn and SnCu HASL finishes were investigated and compared.