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A Patterned Dielectric Support Process for High Performance Passive Fabrication

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3 Author(s)
C. C. Chen ; Nat. Chiao Tung Univ., Hsinchu ; Ssu-Ying Chen ; Y. T. Cheng

This letter presents a micromachining process to effectively reduce substrate loss via a structure of patterned oxide/nitride fins on a silicon substrate with a resistivity of 1 Omega-cm. Experimental results demonstrate that the insertion loss of a coplanar waveguide (CPW) deposited on the structure can be lowered to the value of 4.33 dB/cm at 40 GHz. Meanwhile, an analytical model is developed to predict the characteristics of the CPW.

Published in:

IEEE Microwave and Wireless Components Letters  (Volume:18 ,  Issue: 2 )