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Electrical Modeling and Circuit Simulation for SI Analysis of High-Speed FC-BGA

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6 Author(s)
Ming-Kun Chen ; Department of Electrical Engineering, Tung-Fang Institute of Technology, Kaohsiung, 829, Taiwan, R.O.C. ; Yu-Jung Huang ; Shu-Jung Hou ; Yu-Hung Chen
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The presence of discontinuities along a package interconnection distorts the electromagnetic field pattern, resulting in signal integrity (SI) effects especially at more than 1 Gb/s. Such effects also frequently arise when geometrical and material parameters of components in packages were unexpectedly changed during the assembly process. It may therefore lead to a degradation of the package performance. In this paper, we examine the parasitic effects of signal and power on the high-speed flip-chip ball grid array (FC-BGA) packages. A proposed model is established based on the measurement results. The circuit simulation of the package model can then be performed to analyze the various factors of signal quality.

Published in:

Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on

Date of Conference:

11-14 Dec. 2006