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Electrical Modeling and Circuit Simulation for SI Analysis of High-Speed FC-BGA

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6 Author(s)

The presence of discontinuities along a package interconnection distorts the electromagnetic field pattern, resulting in signal integrity (SI) effects especially at more than 1 Gb/s. Such effects also frequently arise when geometrical and material parameters of components in packages were unexpectedly changed during the assembly process. It may therefore lead to a degradation of the package performance. In this paper, we examine the parasitic effects of signal and power on the high-speed flip-chip ball grid array (FC-BGA) packages. A proposed model is established based on the measurement results. The circuit simulation of the package model can then be performed to analyze the various factors of signal quality.

Published in:

Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on

Date of Conference:

11-14 Dec. 2006

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