By Topic

An Improved Performance Poly-Si Pirani Vacuum Gauge Using Heat-Distributing Structural Supports

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Mitchell, J. ; Michigan Univ., Ann Arbor ; Lahiji, G.R. ; Najafi, K.

A new micro-Pirani vacuum gauge that employs a ladder-shaped structure with two parallel bridges and crosslinks in between has been designed and fabricated. This design enhances the physical performance of the gauge by increasing structural rigidity, thus allowing for longer beams and a wider selection of materials, and by allowing for better heat distribution across the sensor - therefore improving the full-scale range of sensor response. Furthermore, this Pirani gauge can be fabricated in a one-, two-, or three-mask process without postprocessing steps such as KOH etching. In a CMOS-compatible process, poly-Si 4 times 2 times 250-mum and 4 times 2 times 1000-mum Pirani gauges with the ladder structure were fabricated and tested with pressure ranges from 10-3 to 50 torr (0.133 to 1 times 103 Pa) and 5 times 10-2 to 760 torr (6.67 to 1.01 times 105-Pa atmospheric pressure) and with resolutions of approximately 10-3 and 5 times 10-2 (0.133 to 6.67 Pa), respectively. Constant temperature circuitry and thermoelectric temperature stabilization would further extend the range of operation and the resolution of these devices. Furthermore, these sensors operate at very low powers ranging from 300 to 600 muW depending on their geometry and pressure measurement range.

Published in:

Microelectromechanical Systems, Journal of  (Volume:17 ,  Issue: 1 )