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This present work proposed one novel 3D space partition method (SPM) to provide a conceptual 3D layout partition guideline for multilayer embedded RF integrated passive devices (IPD) design with EM coupling sensitivity concerning between several RF passives nearby. The EM design concerns included extrinsic mutual coupling between adjacent passives, and intrinsic model with inherent parasitic in passives themselves. An example of triple- WiMax system (802.16e) diplexer IPD composing low-pass filter and band-pass filter was demonstrated with LTCC process technology to validate the method. Without compromising the overall EM performance away from prototype design goal as expected, instead the component skillfully constructed by this method into a commercial compact SMD chip size of 1.6times0.8times0.7 mm3 and yielded good measured performance and excellent agreement with simulation.