In this paper, we demonstrate three-dimensional assembly of nanoscale materials, including single-walled and multi-walled carbon nanotubes and Au nanoparticles on a flexible parylene-C substrate. The assembly technology combines top down fabrication (fabrication of the three-dimensional microplatform) and bottom up dielectrophoretic (DEP) assembly of different nanomaterials.
Published in:
Semiconductor Device Research Symposium, 2007 International
Date of Conference: 12-14 Dec. 2007