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Three-dimensional nano electronics by dielectrophoretic assembly on a flexible substrate

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4 Author(s)

In this paper, we demonstrate three-dimensional assembly of nanoscale materials, including single-walled and multi-walled carbon nanotubes and Au nanoparticles on a flexible parylene-C substrate. The assembly technology combines top down fabrication (fabrication of the three-dimensional microplatform) and bottom up dielectrophoretic (DEP) assembly of different nanomaterials.

Published in:

Semiconductor Device Research Symposium, 2007 International

Date of Conference:

12-14 Dec. 2007

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