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Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules

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6 Author(s)

The paper presents experimental investigations on both power and thermal cycling conditions on 600 V-200 A six-pack IGBT power modules. Both types of cycles are compared in term of thermo- mechanical stresses by using finite element simulations. Finally, combined stresses are simulated in order to assess the real conditions of use of these devices in automotive applications.

Published in:

Power Electronics and Applications, 2007 European Conference on

Date of Conference:

2-5 Sept. 2007