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Evaluation of Thermal Characteristics and Thermomechanical Reliability of Stacked-die Packages Under Coupled Power and Thermal Cycling Test Conditions

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4 Author(s)
Tong Hong Wang ; Central Labs., Adv. Semicond. Eng., Inc., Kaohsiung ; Chang-Chi Lee ; Yi-Shao Lai ; Ching-Chun Wang

The sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, is performed to investigate thermal characteristics along with fatigue reliability of a board-level stacked-die package under coupled power and thermal cycling test conditions. Different powering conditions and sequences are compared. From the numerical results, we note that under coupled power and thermal cycling tests, reliability performances of a board-level stacked-die package should be similar as long as the total power dissipation prescribed to the package is identical, regardless of how the power distributes among separate dies.

Published in:

Electronic Manufacturing Technology Symposium, 2007. IEMT '07. 32nd IEEE/CPMT International

Date of Conference:

3-5 Oct. 2007