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Three Dimensional Flow Analysis During Injection Molding Process For Stacked-Die Packages

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4 Author(s)
Sung-Won Moon ; Intel Corp., Chandler, AZ ; Cheng Yang ; Zhihua Li ; Fischer, A.

The three-dimensional numerical simulation has been performed to study mold flow characteristics during injection molding process of stacked die packages. The modeling results revealed that flow front shape is highly non-uniform around the die stack-up units and is dependent on various design parameters including mold cap clearance, mold compound material properties, as well as the die stack-up geometric configurations. It was demonstrated that validated flow model can help guiding the design, material, and process optimization of 3D packaging development.

Published in:

Electronic Manufacturing Technology Symposium, 2007. IEMT '07. 32nd IEEE/CPMT International

Date of Conference:

3-5 Oct. 2007

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