Cart (Loading....) | Create Account
Close category search window
 

Three Dimensional Flow Analysis During Injection Molding Process For Stacked-Die Packages

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Sung-Won Moon ; Intel Corp., Chandler, AZ ; Cheng Yang ; Zhihua Li ; Fischer, A.

The three-dimensional numerical simulation has been performed to study mold flow characteristics during injection molding process of stacked die packages. The modeling results revealed that flow front shape is highly non-uniform around the die stack-up units and is dependent on various design parameters including mold cap clearance, mold compound material properties, as well as the die stack-up geometric configurations. It was demonstrated that validated flow model can help guiding the design, material, and process optimization of 3D packaging development.

Published in:

Electronic Manufacturing Technology Symposium, 2007. IEMT '07. 32nd IEEE/CPMT International

Date of Conference:

3-5 Oct. 2007

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.