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Thirty-Second IEEE International Electronics Manufacturing Technology Symposium

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6 Author(s)
D. M. S. Velandia ; Wolfson Sch. of Mech. & Manuf. Eng., Loughborough Univ., Loughborough ; P. P. Conway ; A. A. West ; D. Whalley
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The following topics are covered:manufacturing and test technology, materials for electronics packaging, stacked die and die-attach film, imaging, medical technology, embedded technology, materials in packaging applications, materials for interconnects, lead-free soldering and bonding, lead-free soldering and MEMS, nanotechnology, environmental design.

Published in:

Electronic Manufacturing Technology Symposium, 2007. IEMT '07. 32nd IEEE/CPMT International

Date of Conference:

3-5 Oct. 2007