Cart (Loading....) | Create Account
Close category search window
 

Unified solution of various dielectric-loaded ridge waveguides with a mixed spectral-domain method

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Ng, K.T. ; Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA ; Chi Hou Chan

A mixed spectral-domain method is developed and applied to the analysis of various dielectric-loaded ridge waveguides. Magnetic surface currents at apertures are identified as unknowns in auxiliary structures. Spectral Green's functions are formulated for these structures using the spectral immittance approach. Mixing different spectral domains existing on the two sides of an aperture in a spectral Galerkin approach then leads to the characteristic equations required for the dispersion analysis. The simplicity and numerical efficiency of the conventional spectral-domain immittance approach, which cannot be applied directly to the present structures, are maintained. Representative results are obtained to illustrate the application of the method

Published in:

Microwave Theory and Techniques, IEEE Transactions on  (Volume:37 ,  Issue: 12 )

Date of Publication:

Dec 1989

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.