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Silicon ions were implanted to source-drain regions to achieve a non- alloyed ohmic contact resistance as low as 0.2 Omegaldrmm. Based on this technology, T-shaped deep submicron HEMTs were fabricated. An extrinsic fT of 92 GHz and an extrinsic fmax of 148 GHz have been measured in a passivated 0.15 x 150 mum device. Power measurements at 10 GHz showed 70.7% power-added-efficiency and 4.1 W/mm power density at 20 V drain bias.