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This paper presents compact wide-band equivalent circuit derivation of general 3D bonding array topologies for coupled power-and-signal integrity analysis. The efficiency of the proposed methodology is demonstrated based on real-world SiP (system-in-package) application example. Limits of analytical calculations and quasi-static assumptions with respect to full- wave electromagnetic simulations using different EM methods are discussed. Effects of ground return path on EM coupling is investigated. An original de-embedding methodology appropriate for floating local ground references is used to extract bond wiring coupling parameters including substrate influence. Careful comparisons of obtained simulation results with on wafer measurement results for dedicated test case carriers are discussed.