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This paper discuss three emerging disruptive technologies that have the potential to simplify front-end module designs as the wireless handset community moves forward through 2.5G to 3G and 4G architectures. Integrated passives devices (IPD) is an approach to provide high quality integrated passives using semiconductor processing instead of surface mount devices. Redistributed chip packaging (RCP) is a novel technique to integrate heterogeneous die while providing unmatched density. RF MEMS technology is at the cusp of finally providing a revolutionary paradigm shift in front-end module architecture.