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Fabrication and Characterization of a Wafer-Level MEMS Vacuum Package With Vertical Feedthroughs

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3 Author(s)
Junseok Chae ; Arizona State Univ., Tempe ; Giachino, J.M. ; Najafi, K.

This paper reports a MEMS vacuum package with vertical feedthroughs formed in a glass substrate all at the wafer level. This approach satisfies requirements for MEMS vacuum packages, including small size, vacuum/hermetic capability, sealed and low parasitic feedthroughs, wafer-level processing, compatibility with most MEMS processes, and low cost. It also enables flip-chip solder attachment to a PC board. The package has an integrated micro-Pirani gauge on a glass substrate for in situ monitoring, a silicon cap, and vertical feedthroughs through the glass. The integrated Pirani gauge has 0.6 milli-torr resolution at 0.1 torr and 0.2 torr resolution at 100 torr. Using the Pirani gauge, the fabricated vacuum package is characterized. The package has maintained ~33 torr base pressure with plusmn1.5 torr uncertainty for more than four months without a getter. The long-term measured pressure uncertainty is from the measurement setup and environment, and can be improved using a getter inside the package. [2007-0160]

Published in:

Microelectromechanical Systems, Journal of  (Volume:17 ,  Issue: 1 )

Date of Publication:

Feb. 2008

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