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Broadband planar millimeter wave dipole with flip-chip interconnect

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3 Author(s)
Thomas Zwick ; IBM T.J. Watson Research Center, Yorktown Heights 10598, USA ; Duixian Liu ; Brian Gaucher

In this paper a broadband planar dipole superstrate antenna suitable for integration with millimeter wave (MMW) transceiver ICs is presented. The dipole is printed on the bottom of a fused silica substrate with a ground plane below. This enables packaging together with a transceiver IC using flip-chip interconnect technology. A 60 GHz dual dipole array was flip-chip mounted onto a coplanar waveguide (CPW) thru line to evaluate the antenna design together with the flip-chip interconnect. In the following measured antenna return loss and far field radiation pattern will be shown and discussed.

Published in:

2007 IEEE Antennas and Propagation Society International Symposium

Date of Conference:

9-15 June 2007