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In this paper, a miniature, multi-functional Si-based packaging technology which can reduce the size and cost and increase the performance of a wide range of millimeter wave systems is proposed. High density capacitors, low temperature coefficient resistors, high-Q inductors, low-loss transmission lines, filters and antennas can all be built within the Si package using standard semiconductor fabrication methods with very high manufacturing precision compared to conventional packaging technologies. Fine pitch metal bumps can be used to attach RF IC's and other components, while bonding can provide hermetic sealing where required. Vias through the Si package eliminates inductive bond wires and minimize parasitics at millimeter wave frequencies. By integrating both antenna and an RF IC in one single package, all high frequency signals are confined within the package and only baseband signals connected to the external package.
Date of Conference: 9-15 June 2007