By Topic

Effects of Heavy-Ion Strikes on Fully Depleted SOI MOSFETs With Ultra-Thin Gate Oxide and Different Strain-Inducing Techniques

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Alessio Griffoni ; Dipt. di Ing. dell'Inf., Univ. di Padova, Padova ; Simone Gerardin ; Andrea Cester ; Alessandro Paccagnella
more authors

We study the immediate and long-term effects of heavy-ion strikes on 65-nm Fully Depleted SOI MOSFETs with different strain engineering solutions. Some of the phenomena already present in bulk devices, such as drain current collapse, are still observed alongside some new long-term effects concerning the degradation kinetics under electrical stress. On the other side, early breakdown seems to vanish. SOI degradation after heavy-ion strikes and during following electrical stress is shown to depend on the strain level and strain-inducing technique. We interpreted these results in terms of radiation-induced defects in the gate and isolation oxide.

Published in:

IEEE Transactions on Nuclear Science  (Volume:54 ,  Issue: 6 )