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Parallel Analysis of Transient Scattering by 3D Conducting Objects Using Time Domain Integral Equation Method

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2 Author(s)
G. H. Zhang ; School of Electronics Engineering and Computer Science Peking University, Beijing 100871 China ; M. Y. Xia

A parallel time domain integral equation (TDIE) solver for analysis of transient scattering by large 3D objects is implemented in this paper. The surface is modelled using triangle patches to suit RWG spatial basis functions, and the quadratic B-spline functions are adopted as the temporal basis functions. The present parallelism uses the MPI (message passing interface) communicator. To verify the formulation and codes, a sphere and a cross-plate structure are analysed, and numerical results are compared in good agreements with analytical and moment method solutions.

Published in:

Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, 2007 International Symposium on

Date of Conference:

16-17 Aug. 2007